Wholly New omnipotent combination, easy to use.
Heating upward and downward, Suitable for desoldering BGA ICs.
Angle adjustable according to different sizes of PCBs.
Weight: 4.40 kg
Item added on 19.Aug.2009
Minimum order quantity: 1
Wholly New omnipotent combination, easy to use.
Heating upward and downward, Suitable for desoldering BGA ICs.
Angle adjustable according to different sizes of PCBs.